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UK based Victrex has announced a multimillion euro investment in Bond High Performance 3D Technology. The Dutch company has developed a differentiated 3D printing machinery and software combination which reportedly can produce high-strength parts from existing grades of high-performance thermoplastics. The partnership is intended to provide customers with an accelerated route to market for 3D-printed PAEK parts.
Fine detailed porous structure printed in Victrex PEEK using Bond 3D technology.
Investment - Bond - Technology - Way - PAEK/PEEK
"Our investment in Bond's 3D technology is a logical way to accelerate 3D printed PAEK/PEEK parts to market," Jakob Sigurdsson, Victrex CEO explained. "We need to ensure that all the key elements, including material, process, and hardware are aligned to fulfil our goal of enabling our customers to manufacture 3D printed PAEK components for critical high performance applications. We're now at a stage where the technology is sufficiently developed to embark on exciting development programs."
The common objective, according to Victrex, is to link Victrex’s material application and customer expertise with Bond’s 3D processing technology to produce functional, strong parts that maximize component performance. Bond's technology is capable of printing complex, functional parts made of PEEK with excellent mechanical properties, including in the z-direction. This enables the additive manufacture of high-strength, isotropic parts with properties comparable to conventional molded or machined PEEK parts.
Victrex - Bond - Collaboration - Potential - Spine
Victrex and Bond will initially focus their new collaboration on demonstrating the potential in the spine and the semiconductor segments. These will use commercially available products such as PEEK-OPTIMA from Invibio Biomaterial Solutions, Victrex’s medical business, or VICTREX PAEK thermoplastic. In the future, this ability to print functional parts from existing PEEK grades may also have value in aerospace, energy, automotive, manufacturing and engineering applications.
Currently, Bond’s 3D hardware and...
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