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The Ohio Supercomputer Center's (OSC) Karen Tomko, Ph.D., and the University of Illinois/Urbana's Robert Dodds, Ph.D., recently wrapped up a project that will greatly enhance the simulation capabilities of manufacturing engineers.
Tomko and Dodds were co-principal investigators on the Intel Parallel Computer Center project, a two-year project with the goal of code modernizing WARP3D, an open-source code used by engineers to optimize the robotic welding process for heavy equipment. It is a code used in industry, government laboratories and academia for 3-D nonlinear analysis of solids using finite elements.
Intel - PCC - Program - Funding - Universities
The Intel PCC program provides funding to universities, institutions, and research labs to modernize key community codes used across a wide range of disciplines to run on current state-of-the-art parallel architectures. The primary focus is to modernize applications to increase parallelism and scalability through optimizations that leverage cores, caches, threads, and vector capabilities of microprocessors and coprocessors.
"It was definitely an interesting project because WARP3D was developed as a research code but it has very practical applications in industry, so that makes it more rewarding," said Tomko, director of research software applications at OSC. "It's going to do more than just produce a research paper. It's going to help people designing heavy equipment, it will be used by industry engineers, in the energy and other sectors working with large structures."
Code - Modernization - Project - Effort - Tomko
The code modernization project was a collaborative effort of Tomko and Dodds, a code developer and professor emeritus at the University of Illinois/Urbana, along with OSC's Samuel Khuvis, Ph.D., scientific applications engineer, and Jeremy Nicklas, Ph.D., web and interface app engineer.
"This was a project I was interested in for two reasons," Dodds said. "It was an opportunity to continue working with the OSC applications group, with Karen and her staff, as well as the interactions we were going to have with the Intel technical people....
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